Improved thermal conductivity in microelectronic encapsulants

Several thermally conductive ceramics in combination with different polymer matrices have been examined. The interdependence of thermal conductivity with other key properties of the polymer composites are discussed. Selection of the filler and the resultant filler content in semiconductor grade molding compound are discussed in view of the practical limitations of composite thermal conductivity. Theoretical predictions of the Nielsen model (1973) are considered. The temperature dependence of composite thermal conductivity has been measured, and the effects of different types of polymer matrices are shown.<
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