Monitoring Product Chip Health with In-die Quality Monitors

This study presents a new type of silicon-embedded chip health monitoring sensors. They extend data collection well beyond typically assessed, to include such important factors as mechanical stress, reliability indicators, and gate to contact proximity. The sensors are part of CV Core® system, and their implementation is demonstrated with examples obtained from 7nm and 12nm FinFET products. The results demonstrate unique capabilities to monitor chip health across the whole life cycle.