Hybrid Curvilinear Defected Microstrip Structure to Reduce the Electromagnetic Coupling in PCB

This paper introduces a novel approach to mitigating electromagnetic coupling in high-speed printed circuit boards (PCBs) using a Hybrid Curvilinear (H-C) design strategy. The microstrip circuit board substrate employed is FR4, and the study encompasses a frequency range spanning 0.1 GHz to 10 GHz. By incorporating H and C shapes into the microstrip structures, the proposed methodology achieves significant reductions in both forward and backward electromagnetic coupling. Specifically, the forward coupling is reduced by an impressive -32.12 dB, and the backward coupling is mitigated by -19.16 dB. Comparative analysis against existing methodologies reveals that the H-C design approach yields superior results, showcasing its effectiveness in enhancing electromagnetic compatibility in high-speed PCB applications.