SiC Power Module Design with a Low-Permittivity Material to Reduce Common-Mode Noise

This study proposes a silicon carbide (SiC) power module design to reduce common-mode (CM) noise. A low permittivity material replaces a part of the bottom copper layer of a direct-bonded copper (DBC) substrate, which decreases CM capacitance. The design scheme does not sacrifice thermal performance and the size of power module. The parasitic CM capacitance of the proposed module is reduced by 52.5% compared to that of the conventional module. Double pulse tests verified that the peak CM current was attenuated by 52% and 43% at turn-off and at turn-on instant, respectively. To examine the thermal performance and reliability of power modules, thermal simulations and thermal cycling tests were also conducted.