Packaging at Nanoscale Will Advance Future Heterogeneous System Integration [Guest Editorial]

Nanopackaging will be the main enabler for heterogeneous system integration. This is because packaging of systems with nanoscale materials and processes lends itself to improved properties that lead to better designs, new process solutions, miniaturization, improved functional integration, enhanced reliability and even lower cost. By doing so, nanopackaging seeks to reach the ultimate goal of packaging – which is, to eliminate all the consequences and penalties of packaging. Nanopackaging does this by eliminating the pitch and space transformations from the nanotransistors at <10 nm to system circuit board (or mother board) at 10s of microns. It also reduces the interface parasitic impedance discontinuities, power delivery network impedances, power losses, thermal impedances, interfacial stresses and strains, lithographic package line deviations, die-shifts, electromagnetic interference, etc. This special issue brings out the key nanopackaging solutions towards future computing and communication products.