Mode I fracture of graphene reinforced Sn-Ag-Cu solder joints

Mode Ⅰ fracture behaviors of graphene nanosheets (GNSs) reinforced Sn-3. 0Ag-0. 5Cu(SAC305) were investigated based on T-Peel test in this paper. By mechanical mixture of GNSs with SAC305, an enhanced mode Ⅰ fracture toughness is obtained at content of 0. 10 wt% GNSs. Mode Ⅰ fracture toughness of SAC305 with different contents of GNSs has been investigated. Upon adding the proper GNSs, the cracking path in SAC305 turns to be cohesive cracking easily, which leads to increase of mode Ⅰ fracture toughness. The average critical energy release rate obtained at content of 0. 10 wt % GNSs sac305 has been increased by 94. 56% and the maximum critical energy release rate was increased to 2. 2 times that of average condition in SAC305 without additive. The enhancement mechanism and agglomeration effect of GNSs are discussed , the different microstructural characteristics of the sample after mode Ⅰ fracture are introduced. The fracture properties of SAC305 with different graphene additive contents are discussed and clarified. The sintering method proposed in this paper meets the requirements of solder joint interconnection technology. This study presents a new insight for adding carbon-based nanomaterials to electronic packages to improve the mode I fracture of SAC305 solder.