A Comprehensive Thermo-Mechanical Characterization of Organic Substrates

When a substrate-based plastic package is subject to temperature loadings, some thermo-mechanical failures usually result. They are mainly caused by the mismatch between thermal and thermo-mechanical material properties of the diverse components constituting the package assembly, in particular related to the multi-layered organic substrate. The estimations of the material thermal expansion, glass transition, temperature degradation, specific heat, and stiffness are becoming necessary for understanding the behavior of the organic substrate during thermal loads. This paper deals with a full material characterization of the organic substrate and its main components by adopting standard experimental methodologies. The analysis allows us to evaluate an identity card of the organic substrate and to create a material model useful for the prediction of some thermo-mechanical failures which appear when a substrate-based package is exposed to temperature loadings.