Bending Experiments on QFN Components

Quad Flat No-Lead (QFN) packages have become increasingly popular in microelectronic applications due to their compact size, thermal efficiency, and electrical performance. The primary objective of this study was to identify the critical bending conditions that trigger crack initiation within QFN solder joints which was achieved through electrical measurement. The study explores the strains distribution within QFN assembles as they undergo bending, revealing critical insights into how mechanical loads are transferred through these components. Understanding strains distribution is vital for optimizing board designs for the usage of QFN packages, thereby enhancing their mechanical robustness and reliability. This investigation provides critical information for future study with FEM simulation of QFN components, enabling them to make informed decisions regarding the selection and implementation of QFN packages in applications with mechanical stresses.The results of these experimental studies about the deformation of the PCB are presented. The experiments involve subjecting QFN component to controlled bending forces while monitoring mechanical strain using Digital Image Correlation (DIC) and related parameters.