A New Inductor Assembly Method for POL Power Module 3D Packaging

The application and market penetration of integrated power module has been growing rapidly thanks to the strong market driven of high performance and higher power density power solution. The point of load (POL) converter power module has been widely used due to its characteristics of compact size and high power density. This paper proposes a new inductor assembly method for POL power module 3D packaging. The typical inductor production process has the problem of large series resistance of the pins, which increases the loss when the power supply outputs a high current. Thereby, applying the traditional manufacturing process of inductor to POL module will bring the problem of high power loss and mechanical instability. In this paper, a new stacking structure of POL module is proposed, which reduces the power loss, enhance the mechanical stability, and be thermally conductive for heat dissipation.