Reliability Testing Technology and Equiment for Interconnection between PCB and Chips

Solder joints are the nodes connecting circuit boards and chips, as well as ensuring the normal operation of electrical signals and circuit functions, and their importance is self-evident. This article mentions an electronic device that can be used to monitor the interconnection and health status of pins in circuits. The device implant lightweight diagnostic logic and test auxiliary circuits into the monitored object base FPGA. It uses the impedance characteristics introduced by solder joint failure to perform signal transformation, real-time monitoring and capture of solder joint faults are carried out, raw data are sent to acquisition terminal. The acquisition terminal analyzes, fits, and predicts the trend of feature data changes, achieving early identification and warning. This technology and equipment can be applied in testing tracking or random analysis warning of major equipment or devices.