Automatic Heating Technology Module

In this paper discusses the fact that all thin film coatings deposited on semiconductor and dielectric substrates modify the influence of mechanical stresses that can bind the structure and it is necessary to minimize this influence. Describes the development of a thermal heating module to reduce the effects of mechanical stress. The work shows a systematic approach to the development and commissioning of a heating module. Heating the substrate before forming the coating can reduce the influence of mechanical stresses by reducing the difference in the coefficient of thermal expansion. The use of a point thermocouple allows you to more accurately measure the temperature characteristic due to a decrease in overall size.