Prospects of Design of Electronic Equipment Enclosures by Means of Additive Technologies

This research paper is devoted to analyzing the basic principles of design of enclosures of electronic equipment for additive manufacturing. The paper collects and analyzes the methods of design of electronic equipment enclosures that increase the strength characteristics of the finished product and the quality of finished surfaces. Attention is paid to design solutions that reduce the number of supporting elements and complexity of the manufactured product. The article considers physical processes that occur during production: plastic shrinkage, internal stresses in the housing and methods of eliminating their influence by changing the shape of the product. Recommendations are given on printing setup when using layerby-layer build-up. Attention is also paid to the methods of joining parts of electronic equipment housing produced by additive technologies (AT). The article gives a classification of techniques and methods for the adaptation of electronic equipment enclosures for production with the usage of additive technologies.