Integrated Process-Mechanical Stress Analysis of 2.5D/3D ICs with Two Types of Interconnections in Advanced Packaging

Soldering and Cu/Cu direct bonding are the two main interconnection approaches in 2.5D/3D ICs advance packaging. The manufacture process of these joints determines the joint quality and has impacts on chip/device performance and reliability. For soldering, this paper proposed a multiscale framework to introduce the influence of solder ball reflow process to further shock reliability simulation. For Cu/Cu direct bonding, a simulation workflow is introduced which considers the dish effect from Chemical mechanical polishing (CMP) and uses thermo-mechanical coupling solver and a novel pseudo-bonding model to model the bonding process. Subsequently, the bonding defects and strength could be predicted by stress analysis.