An automatic channel test scheme for multi-chip stacked package with inductively coupled interconnection

Inductively Coupled Interconnection (ICI) is a wireless inter-chip interconnect for 3D stacked packages, which can provide high-bandwidth communication between chips with more flexibility and lower cost than through silicon via (TSV). However, the chip selection and functional testing in multi-chip stacked are awkward without a physical connection. This paper presents an automatic channel test scheme for multi-chip stacked using ICI, including auto layer sorting and transceiver power tuning. This scheme can improve the testability of wireless-connected 3D chips and decrease the utilization of wire bonding. The test result shows the power of multi-layer stacked chips with ICI is reduced by a maximum of 23.15% after power tuning.