Abstract:
The amplification procedure of polymerase chain reaction (PCR) involves the utilization of a thermal cycler. Certain cutting-edge technologies require temperature fluctua...Show MoreMetadata
Abstract:
The amplification procedure of polymerase chain reaction (PCR) involves the utilization of a thermal cycler. Certain cutting-edge technologies require temperature fluctuations that occur with the utmost precision. However, commercial heat cycles continue to be sizable and costly, and are typically only found in research facilities. This restricts the ability to perform at a particular place DNA screening and ailment. In this endeavor, a low-cost, lightweight thermal cycler was conceived and manufactured. It was possible to incorporate sixteen micro centrifuge tubes within the thermal cycler block. A Proportional-Integral-Derivative (PID) temperature controller was utilized to regulate the thermal cycler block's temperature. Consequently, the proposal was made for a Bismuth Telluride Peltier element. By means of an electrical current traversing the junction, thermal energy is transferred between the Peltier element's terminals. For proper operation, a load or heat absorber must be placed on both sides of the Peltier element. The RTD temperature information is used to configure the pulse with modulation (PWM) signal of the PIC microprocessor. Implementing PID control logic required the development of a microprocessor controller. The respective values of the proportional gain (Kp), integral gain (Ki), and derivative gain (Kd), for the PID controller were 16 A/V, 0.7 A/V, and 0.3 A/V. In conclusion, 16 DNA samples, each estimated to have a molecular weight of 180 base pairs, were amplified using the heat cycler design. It was substantiated by gel electrophoresis results and the nexus gradient structure of the Eppendorf Master cycler.
Published in: 2024 2nd International Conference on Intelligent Data Communication Technologies and Internet of Things (IDCIoT)
Date of Conference: 04-06 January 2024
Date Added to IEEE Xplore: 22 March 2024
ISBN Information: