Achieving Spaceworthiness for Large-Size LTCC Packaging of Microwave MCM

This paper describes the various methodologies for realization of microwave subsystems through packaging of multiple bare MMICs. The use of LTCC substrate for packaging of hermetic multi-chip modules (MCM) has given significant benefits in terms of miniaturization and mass reduction. However, it poses several challenges for assembly and hermetic sealing of these large-size (>35 mm in both dimensions) LTCC modules. Various techniques for assembly and hermetic sealing were attempted and their outcomes are summarized.