Enhancement of Glass micromachining using selective copper electroplating

The wet etching technique for glass micromachining is widely used in MEMS (Microelectromechanical System) to create complex structures and features at the micro-scale. One critical aspect of the glass etching process is the application of effective masking layers, which protect specific areas from the etching process. Thispaper discusses the combination of Chromium, Gold, and selective electroplated Copper layers to improve the efficiency of the masking layer. The electroplated copper layer provides a uniform and well-defined masking surface, allowing for more accurate pattern transfer onto the glass substrate. Additionally, it is a cost-effective solution, making it an attractive option for various applications. A low concentration of Hydrofluoric acid was used as the glass etchant to minimize undercutting and to enhance the control over the etching process. The etched glass substrate was characterized using an optical microscope and a confocal microscope to determine the etch depth and to analyze the surface morphology.