Enhancing Fusion Bonding of Fused Silica through Surface Treatments: A Comparative Study

Wafer bonding is a process in Micro Electro Mechanical Systems (MEMS) and microelectronics fabrication, allowing for integrating different materials and devices into a unified structure. Fusion bonding, a specific type of wafer bonding, offers several advantages, including high bonding strength, excellent thermal stability, and compatibility with various materials. This technique directly joins two substrates without requiring intermediate layers, making it a preferred choice in many applications. In the proposed work, a comparison study of the various surface activation techniques on different glass samples to modify the surface properties for better bonding strength with low bonding temperatures. The surface-activated samples are characterized using Raman Spectroscopy to identify the best suitable treatment for fusion bonding. Further, fused silica - fused silica samples are directly bonded at 400 °C temperature after surface activation. The bond strength of these bonded glass samples is measured using Die shear tester.