Antenna-in-Package Electrical Research for Beyond 5G application

Fan-Out Antenna-in-Package (FO AiP) using the structure based on the Fan-Out Package-on-Package (FO POP) has been exhibited in this paper. FO provides shorter path connection to the antenna, fine line width/spacing and better thickness control. Fig. 1 shows the performance and structure of the antenna with two stacked molding compound thickness. The thickness range of the molding compound could be from 60um to 250um and the line/space is scalable 5um/5um~10um/10um. The D-Band 140GHz antenna could be designed for beyond 5
^TH
generation (B5G) application with these thickness and line/space. The FO-AiP package provides the benefits of well tolerance control and good roughness of the copper when manufacturing. In this investigation, antenna designed with FO process shows a good performance, over 20% bandwidth under -10dB impedance match and 7.1dBi radiation gain at D-Band 140GHz, that makes the FO-AiP becoming a strong candidate for future B5G application.