Experimental Investigations on Thermal Superposition Effect by Embedded Manifold Cooling

With the development of high-performance multi-core microprocessors, the increase in hotspots density poses a severe challenge to chip thermal management. Embedded cooling can improve the cooling performance at the chip level. However, the cooling efficiency will be deteriorated by the interaction of hotspots. In this paper, four types of manifold structure based on embedded cooling are designed and fabricated, and the coupling effect between the hotspots in chip are analysed from experimental analysis and test verification, and the optimal structure is obtained. The results show that the three-dimensional manifold scheme can effectively inhibit the hotspots interaction and improve the cooling performance.