Hard bond pad plastic deformation study for adhesion estimation by 3D FEM modelling of wire bonding process

Bond pad structure design is one of the main challenges in the study of Chip-Package Interaction (CPI). The introduction of Copper (Cu) wire requires design solutions to ensure wire pad joint reliability and pad structure integrity. In this context, Nickel-Palladium bond pad finishing represents an improvement, implying different bond formation mechanisms versus Aluminum metallization. Computer Aided Engineering (CAE) helps to describe ball bonding process behavior and enables different bond pad structures screening at design level. This work will describe ball deformation and bond adhesion over two different pad schemes: Finite Element Method (FEM) model is defined and dedicated experimental activity validation is performed.