Predicting Package Breaking Load of Thin BGA Packages Through Mechanical Modeling and Simulation

With thin ball grid array (BGA) packages, the package breaking load in bending must meet a certain required value. However, evaluations of several package configurations to determine which would meet the requirement is a costly trial and error approach. This study presents the prediction of package breaking load of thin BGA packages through mechanical modeling and simulation during the design phase prior to actual package assembly. Results showed that the finite element analysis (FEA) predictions were consistently in good agreement with actual data for the different package sizes. The use of stronger substrate core material provided higher breaking load for bending at live bug package orientation only. However, increased mold cap thickness improved both live bug and dead bug package bending performance. The developed package 3-point bend model with the established model calibration parameters was proven reliable and robust in predicting package breaking load and could prevent overdesigned packages.