2-D Modelling of Fan-Out Panel Level Package and its Warpage Suppression Solution

This research was conducted on a fan-out panel level package (FOPLP) based finite element modeling (FEM) that focused on material selection, design, and process optimization to provide a solution for warpage suppression for liquid crystal display (LCDs). In this model, various layers are used for different thicknesses and materials such as glass layer with the thickness of (1100 μm), release layer (2.1 μm), titanium layer (0.3 μm), copper layer (0.5 μm), and polyimide layer (7 μm). Further simulation & parametric research is conducted with help of Ansys mechanical APDL software. After performing the simulations from the glass substrate to the via layer with a warpage of 913.49 μm with metal distributed in polyimide (PI). In addition, metal splits were incorporated in the active circuit and dummy metals. By splitting the active unit, warpage was reduced to 807.68 μm. Due to the very small metal present in the active unit, it can’t split more. Furthermore, this work studied the impact of dummy metals with different ratio of metal and PI. Therefore, after splitting the dummy into several parts, with different ratios of metal and PI. The placement of dummy metal at various places such as (Left, Center, and Right). Based on the results, an analogy indicates that metal placed on the edge of fan-out panel level package exhibited the lowest warpage (568.97 μm) compared to the left (598.69 μm). And center (593.69 μm). By separating the right-side metal into two sections with polyimide (PI) in between, the warpage was further reduced to 374.17 μm.