Adhesive Fracture Analysis of Die Attach Film-Laminated Tape by 90° Peel Tests and Finite Element Analysis

Understanding the interfacial adhesion performance of DAF-laminated tape (DAF/tape) to its substrate is crucial to ensure package reliability. In this paper, the 90° peel testing method combined with the fracture energy-based Cohesive Zone Model is proposed to evaluate the interfacial adhesion of DAF/tape to the substrate. The method determines the interfacial adhesion energy of 0.48 N/m and the corresponding maximum normal stress of 3 MPa. In addition, fluctuating adhesion behavior at the DAF-to-substrate interface is captured in both experimental and simulation data, which is attributed the design of the tape-pick-up tool.