Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging

The drive towards quantum computing has prompted a need for advanced packaging technologies capable of withstanding the harsh cryogenic environments in which qubit devices operate. This study explores the viability of SnAg (Tin-Silver) as a suitable candidate for solder material in cryogenic interposer advanced packaging. This paper reports the characterization of the critical temperature (Tc) of SnAg, a vital parameter for its performance in cryogenic applications. Experimental investigations reveal a Tc of 3.32K, highlighting SnAg's superconducting properties. This finding opens avenues for employing SnAg as an interconnect material in flip chip assembly process.