Design Optimization to Boost Solder Joint Reliability Performance for SSD BGA Package

The automotive industry has undergone a continuous transformation over the past 130 years and is now increasingly associated with safety applications. Autonomous Vehicles represent the next major revolution in this sector. Numerous automotive companies are actively participating in fostering the rapid growth and realization of this promising new era. To keep pace with this revolution, high-reliability memory products with innovative solutions must be developed to support automotive manufacturers. However, a significant challenge lies in the compressed time-to-market demands, as carmakers seek the latest memory technologies available. The qualification process, especial for reliability testing, typically takes several months from design to successful qualification. To address these challenges, a framework with a shift-left phase involving the Finite Element Tool (ANSYS) is introduced, enabling the assessment of reliability performance during the early design stage. The new generation of SSD ball grid array (BGA) goes beyond the small form factor by incorporating DRAM into the package, maximizing steady-state performance for virtualized and centralized storage in automotive applications. To meet stringent temperature cycling reliability specifications, crucial design factors are identified to optimize solderjoint reliability performance for the new generation SSD BGA package.