uPoP- Innovative Solution for Mobile Memory Package

A totally new structure for universal flash storage (UFS) and dynamic random access memory (DRAM) connection to system on chip (SoC) for mobile application which with conflict in electrical performance and design dimensions. The uPoP structure which is UFS mounted on DRAM, the bottom DRAM ball map and the stacked structure function is the same with universal flash storage multi chip package (uMCP). This paper is about UFS package on package (uPoP) concept introduction, performance and thermal simulation analysis, performance and thermal real test, Package reliability. The result show uPoP and meet uMCP application condition and pass package reliability.