Excellent Reliability Organic Thermal Interface Materials for SiC Power Module

Performance of SiC based power module performance can be increased/enhanced due to its much higher power output, power dissipation and much greater packaging density, which in turn results in big challenge to its thermal management. Usually, a ceramic heat conductive sheet such as direct bonded copper (DBC) and a grease as thermal interface materials (TIM) are used to contact a heat-sink (HS) for heat dissipation of the power module. However, interfacial thermal resistance of the grease is very high, so it is the bottleneck of the heat dissipation. In this paper, a thermal conductive adhesive film (TCAF), 15 W/m•K, made from polyimide based novel adhesive resin and thermal conductive filler is used as TIM instead of DBC and grease in order to reduce the interfacial thermal resistance between TIM and HS. We have demonstrated the fabrication of SiC double side cooling power module with good adhesion between TCAF and HS without any voids. There was no TCAF delamination on HS and crack even after 50,000 cycles power cycling test between 50
^o
C and Tjmax=200
^o
C.