An Extensive Study of the Effects of Packaging Structure and Material Properties on Reliability of Advanced Packages by Charactering the Stress Singularities at Interface Corners

This paper presents a new approach to acquiring in-plane solutions for the stress singularities at internal junctions where multiple elastic isotropic materials meet, and then establishing the correlation between the singular stress field and the failure of electronic package structures. Extensive analyses have been conducted on the order of the stress singularities in relation to the material properties and interface angles, which address an important yet controversial issue regarding the utilization of the stress singularity for electronic package reliability assessment. The results obtained through calculating the stress singularity orders are further validated using finite element analyses. The basic findings indicate that the analyses of the singularity order can serve as an initial approach to evaluate structural design and system reliability. However, relying solely on the calculations of the stress singularity order is insufficient when exploring the variations in material parameters. Despite that, the calculations of the order of stress singularity still provide valuable guidance for electronic package design and help develop more robust and reliable packaging solutions for integrated circuit devices.