Recycled Tin Lead Free Solder Paste for Advanced Packaging: A Sustainable Solution for Electronics Manufacturing

Lead-free solder pastes have become the preferred choice in advanced packaging applications due to environmental and health concerns associated with lead-based solder. With growing global demand for electronic devices, solder consumption would subsequently increase. Environmental worry associated with the consumption of tin, a primary component of lead-free solder, raised questions about the sustainability of tin resources. The recycling of tin has emerged as a crucial strategy to meet resource needs while minimizing the environmental impact associated with primary tin production. Understanding the performance and compatibility of recycled Sn lead-free paste is crucial for evaluating its viability as an alternative to virgin Sn lead-free paste.This paper investigates the potential of recycled Sn lead-free solder paste as a sustainable alternative to virgin Sn lead-free paste, emphasising the key application performance with reference to advanced packaging applications. It examines the influence of recycling processes on the solder powder morphology, solder composition and particle size distribution. Assessing their impact on solder joint quality, wetting behaviour, electrical conductivity, and mechanical integrity.The paper concludes the performance and compatibility of recycled Sn is comparable to virgin Sn lead-free paste in advanced packaging applications. Through comprehensive testing, the industry can gain insight into the viability of recycled Sn lead-free paste, optimize its use in various applications. It underscores the importance of industry collaboration, technological advancements, and regulatory support to drive the adoption of recycled Sn lead-free paste and foster a more environmentally conscious approach to advanced packaging.