Low-temperature solder for low-carbon emitting process

Temperature is a critical factor for manufacturing. In terms of consumer electronics, thermal warpage and damage induced by high-temperature processes. The high processing temperature must be reduced to avoid the reliability degradation of packages due to thermal damage of temperature-sensitive devices. High-temperature processes also simultaneously produce more carbon emissions. Daily life is extremely glutted with mobile devices. Therefore, reducing process temperature could lower device damage and carbon emissions. To resolve potential thermal stress problem, low temperature bonding technology is essential for producing reliable mobile devices. In-based and Bi-based solders are used in this study for the research of low-temperature solder. Their low-melting temperature, excellent conductivity, and heat dissipation are supposed to improve thermal budget and carbon emission. The interesting microstructure include Bi segregation, abnormal Cu
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Sn growth and the transformation of Cu-In compounds. The aim of this study is to use the novel materials for reducing process temperature and increasing service life. A great promise for green economy and carbon reduction.