Si Bridge With Chessboard Patterned Interconnect (CPI): Enabling High Density, High Efficiency Heterogeneous Integration

Si bridge with chessboard patterned interconnects (CPI) scheme has been investigated, enabling high-density and high-efficiency heterogeneous integration (HI). Unlike conventional S-G-S-G structures that only use 2 layers for signals, CPI efficiently utilizes orthogonal ground lines to achieve 4-layer signal transmission. This results in a twofold increase in routing density, significantly reducing the required data rate. The practicality of this approach has been demonstrated through signal integrity analysis using 3D EM simulation. Furthermore, we addressed the improvement of crosstalk noise characteristics within the CPI structure and introduced a selective configuration for efficient signal transmission.