VIE-DDM Based PEEC Method with Parallel Technology for DC Analysis of Packaging Circuit

This paper has developed a novel partial element equivalent circuit (PEEC) method based on volume integral equation (VIE) combined with domain decomposition method (DDM) for the direct current (DC) simulation from electric large-size and multiscale packaging circuits. In order to enhance the flexibility, the conformal mesh and the nonconformal mesh are adopted for geometrical modeling, and the SWG basis functions and half-SWG basis functions are used to discretize the volumetric currents. To improve the efficiency of the geometrical modeling and the calculation speed of matrix elements, the DDM and parallel strategy are adopted. Finally, numerical results are given to demonstrate the validity and efficiency of proposed VIE-DDM-PEEC method.