Design of the 28 GHz Antenna-In-Package (AIP) Using Glass Embedded IC Technology

This paper presents the design and implementation of a high-performance and cost-effective 28 GHz antenna-in-package (AIP) based front-end-module (FEM) utilizing glass embedded IC technology. The integration of key technologies, such as coaxial through-glass-via (CO-TGV), stacked antenna, and coplanar waveguide with ground (G-CPW) bump transition, offers a promising solution for advancing millimeter-wave (mm-Wave) wireless communication systems. The conventional through-glass-via (TGV) structure typically exhibits a high inductance component, making impedance matching challenging at high frequencies. Therefore, adopting the CO-TGV structure with a 50-ohm impedance minimizes parasitic components in the feed connection and ensures excellent RF signal performance. The stacked antenna structure, incorporating secondary patch-type parasitic elements, provides improved bandwidth, enabling higher data transmission speeds and quality in the high-frequency range. The G-CPW bump transition ensures low reflection loss, insertion loss, and efficient integration through high impedance matching compensation. By leveraging embedded IC technology with glass substrates, this research contributes to the development of high-performance and cost-efficient packaging solutions for mm-Wave chips.