A Differential Phased Array Antenna for 60 GHz Heterogenous Integrated AiP Applications

Abstract-A novel heterogeneous integrated antenna-in-package (AiP) solution is proposed for 60 GHz high-performance phased array applications. Based on the fan-out process, the differential phased array antenna, RF CMOS and TSV chips are integrated with multi-layer molding compound martials stack-up. Using parasitic patch and folded full-wave dipole as radiators, the differential antenna element achieves an impedance bandwidth of $\left|\mathrm{S}_{11}\right| \lt -10 \mathrm{~dB}$ from 53.7 to 69.8 GHz, a peak gain of 6.45 dBi. In addition, for antenna element measurement purpose, a test structure is realized which is co-designed with the TSV transfer chip and motherboard. For the scalable 16-element antenna array, the simulated peak gain at broadside is 17.4 dBi, with a 3 dB beam coverage from 30° to 30° in the E-plane and from −50° to 50° in the H-plane at 60 GHz.