Realization of Sustainable Additively Printed Circuits using Aerosol-Jet Inkjet and Direct-Write Processes

Water-based inks have been developed to achieve conductive circuits using additive processes, due to the increasing importance of environmental, social, and geographic factors in electronics manufacturing. However, little is known about the water-based formulations regarding process-performance-reliability interactions and the performance and reliability of water-based ink-printed circuits with surface-mount devices. This study examines the process-performance-reliability interactions for three print platforms (aerosol-jet, inkjet, and direct-write) using water-based low-environment impact waste inks to realize circuits. The effect of downstream thermal exposure is also analyzed by designing and testing surface mount circuits on all three print platforms, with component attachment achieved through low-temperature solders and electrically conductive adhesives. The evolution of resistance and shear load to failure is studied for pre-attachment and post-attachment circuits on all three print platforms, with applications demonstrated including signals and amplification. Comparative designs using volatile organic compound-based inks are also included.