TIE-M Plus: Promoting Structural Analysis Learning with Competition

This paper introduces the TIE-M Plus (Techniques of Interconnection in Electronics – Mechanical) student contest, extending the long-standing TIE environment. TIE-M Plus focuses on Finite Element Analysis (FEA) and includes two sections: Structural Analysis and Thermal Management Analysis. The paper proposes a competition workflow, discusses the construction and evaluation of the TIEM Structural Analysis subject, and addresses the challenges faced during its development. The TIE-M Plus contest provides students with a comprehensive electronics development experience incorporating structural and thermal aspects. The findings emphasize the importance of continuous student engagement to create meaningful educational opportunities that meet industry demands. Close communication with potential contestants during the early stages was essential to gauge their competencies and align them with private sector requirements. Overall, the TIE-M Plus contest aims to contribute to the advancements of STEM (Science, Technology, Engineering and Mathematics) education and the practical application of electronics knowledge.