Design and Analysis of Broadband Vertical Via Interconnection Technology for Multilayer Circuit Board of Heart Rate Sensor

In this paper, a broadband vertical interconnect structure for multilayer circuit board of heart rate sensor is designed. Signal transmission between different layers often requires vertical vias for interconnect transitions. For active devices, the interconnect transition between coplanar waveguides (CPW) and striplines is extremely widely used. As the operating frequency increases, the transmission characteristics of the circuit are reduced. Therefore, this paper designs a broadband vertical interconnect structure based on coaxial vias. A grounding holes are added along the transmission line to suppress the parallel plate pattern. Through modelling analysis and simulation optimization, the return loss S11>20 in the DC-50GHz frequency range, and a wideband, low-loss vertical interconnection structure is realized.