Modeling and Analysis of Wideband Gold Ribbon Interconnection with Multi-Chip Modules on Si-Based Package

In this paper, the broadband gold ribbon interconnection structure in a multi-chip module based on silicon-based packaging is modeled and analyzed. Gold ribbon has better transmission characteristics than gold wire, but with the increase of operating frequency, the transmission characteristics of the circuit will decrease. Therefore, this paper analyzes the influence of different sizes and quantities of gold ribbon on the transmission characteristics, and designs a compensation structure according to the high and low impedance lines to compensate for the reduction of transmission characteristics caused by the gold ribbon, and realizes the return loss S
11
>15 in the range of DC-15HZ, and both broadband and low-loss interconnection structure is realized.