The Development of a Forced Cooling System for the AVM-039 Heat Sink for Power Electronic Devices

This work is devoted to the development of a forced air-cooling system for power IGBT modules used as an integral part of a step-down converter. A model FF1800R17IP5P of the IGBT module (produced by Infineon Technologies AG, Germany) was chosen for the converter. A heat sink of the AVM-039 type (produced by the Aluminum Profile Factory, Russian Federation) was chosen for cooling the IGBT modules. Three-dimensional geometric models of the IGBT module (taking into account its internal design) and the AVM-039 heat sink were developed in the SolidWorks software for subsequent calculations. Further, those geometric models were imported into the COMSOL Multiphysics software, then a model of heat transfer processes was developed for natural and forced air cooling of the heat sink for different placing of IGBT modules (6 modules). The most rational arrangement of IGBT modules on the heat sink and the required cooling air flow were found through a series of calculations. The paper presents the developed models, the achieved results are shown and analyzed.