Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly

With the continuous growth of disaggregated systems, a need for new modular platforms to facilitate integration arises. A rePlaceable INegrated CHiplet (PINCH) assembly technology with the capability for reassembly, upgradeability, testing, and prototyping systems of multiple chiplets at once is presented. PINCH consists of a socket platform, positive self-alignment structures (PSAS), compressible micro interconnects (CMIs), and an interposer for die-to-die connectivity. The substrate-agnostic PSAS-to-PSAS self-alignment technology allows us to achieve sub-micrometer alignment accuracy without the need for advanced alignment equipment. CMIs are nonpermanent compliant OFF-chip electrical interconnects with the capability of compensating for height differences and nonuniform assembly force. 2-D arrays of
$33\,\, {}\times {}33~150~\mu \text{m}$
pitch CMIs are tested using the PINCH assembly platform and four-wire resistance measurements are reported. The total I/O count comes to 1089 per die. Single-chiplet and multi-chiplet implementations of PINCH are discussed. The total average resistance between chiplets was 113.8
$\text{m}\Omega $
for the single-chiplet assembly and 127.7
$\text{m}\Omega $
for the multi-chiplet assembly.