Adhesive Solutions for Closed Cavity Packaging

The trend towards autonomous driving demands continuously increasing safety requirements and hence reliable components such as CMOS image sensors or communication devices. To provide such components, manufactures are facing ever greater challenges as the sensor packages need to be airtight sealed over their whole lifetime. Typical defects that can be observed when using conventional lid attach materials for closed cavity packages in tests at automotive level (e.g., according to AEC Q100) are pop-up effects and delamination. To avoid these defects and to meet the increasing reliability requirements of the semiconductor industry, DELO Industrial Adhesives has developed special adhesives that not only ensure reliable bonding while keeping narrow and high bondlines, but also improve process stability. Features such as light/heat B-stage or light fixation help to keep the attached lid in place during heat curing and other subsequent steps like temperature cycling, humidity storage and even reflow.