High Speed Transmission Characteristics on Glass Based Interposers

Interposers for system in package will became more and more important for advanced electronic systems. As the industry moves toward HPC (High Performance Computing) for huge data transmission with low power consumption. The major engineering requirements for HPC application are high-density, high speed data transmission, low loss, precision manufacturing and low cost. On the 2.5D heterogenous package structure, key technology is fine wiring connected with CPU chip and HBM chips. The fine wires needed high speed transmission. This paper presents the demonstration of Glass-based twin type interposers, Glass interposer with fine pitch metalized through via and RDL interposer with low loss dielectrics on Glass carrier. We compare twin types of Interposes fabrication process capability with panel size format 300×400mm. Finally, we compare the transmission characteristics using eye diagram for heterogenous integration application. Glass Interposer has low loss glass via, it is effective vertical interconnection. RDL interposer has low loss dielectric layers, excellent transmission characteristics obtained on fine pitch trace area.