Comparative Study of Different Microchannels for Microfluidic Packages with Integrated Thermal Management in Power Applications

This paper presents package-level cooling of microelectronic devices using microfluidic-channel-based heat exchangers fabricated using Direct Metal Laser Sintering (DMLS) This paper builds on previous work done on additively manufactured, package-level, microfluidic thermal management systems and extends this work to demonstrate different designs of Microfluidic Channel (MFC) heat exchangers fabricated using laser sintering. When a wavy channel was used for the MFC, the steady-state thermal resistance was reduced to 1.22°C/W compared to 5.25°C/W for a conventional package.