Back-end-of-line integration of 2D materials on silicon microchips

Two-dimensional (2D) materials have excellent electronic and thermal properties that could help to improve the performance of electronic devices and circuits. However, scalable 2D materials synthesis and their integration in silicon microchips (with, for example, complementary metal-oxide-semiconductor, CMOS) transistors presents some challenges, mainly related to the presence of local defects that degrade device/circuit performance. In this invited article, we discuss the integration of 2D materials in silicon microchips. We analyze the type of materials and their properties, the main synthesis and manipulation methods, the type of circuits fabricated, the electronic performance achieved, as well as the future challenges and solutions. We focus on microchips with pre-patterned CMOS circuits on which the 2D material is deposited at the back-end-of-line (BEOL).