Fretting Wear Failure Modeling of Press-Pack IGBT Device based on Digital Twin Method

Fretting wear failure is one of the main failure modes of Press-Pack IGBT (PP-IGBT) device. This paper presents a method to simulate the fretting wear failure of the PP-IGBT device based on digital twin modeling. Firstly, the digital twin model of the PP-IGBT device is established by considering power input as feedback, and the electrical, thermal, and mechanical stress distribution inside the devices is analyzed. Secondly, based on the aging test results of the PP-IGBT devices, the mapping relationship between the contact thermal resistance and the number of cycles is extracted, and the digital twin model of the PP-IGBT device with contact thermal resistance changes is established. Finally, the digital twin simulation of a multi-chip PP-IGBT device is carried out, and the results are verified by power cycling experiments. The experimental results show that the junction temperature error between the fretting wear aging modeling and the experimental result is less than 2.5 °C.