Proposal and Analysis of Coaxial-Through-Glass Vias in 3-D Integration Using Multiresolution Time-Domain (MRTD) Technique

Coaxial through-glass via (coaxial-TGV), one of the promising 3-D integration solutions, can offer a reliable and high-performance signal transmission through a glass substrate at high frequencies. This article utilizes electromagnetic theory to derive analytical closed-form formulas for calculating the per-unit-length resistance and inductance of a coaxial-TGV configuration filled with the isolation dielectric benzocyclobutene (BCB). An accurate wavelet-based numerical multiresolution time-domain (MRTD) technique is developed to analyze the crosstalk effects in coupled coaxial-TGVs. This work focuses on determining the propagation delays, peak crosstalk voltage, and timings in CMOS-gate-driven coupled coaxial-TGVs for both in-phase and out-phase scenarios. The proposed MRTD method’s performance evaluation is carried out through recursive simulations using SPICE. The analysis reveals that the MRTD scheme exhibits higher accuracy compared to the conventional finite-difference time-domain (FDTD) scheme when compared with SPICE, with a maximum error of less than 1%. The application of the proposed MRTD technique can be expanded to encompass the transient analysis of
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-coupled coaxial-TGVs. This extension proves valuable in assessing signal integrity, electromagnetic interference (EMI), and electromagnetic compatibility (EMC) concerns related to coaxial-TGVs.