X-Band Four-Channel Ball Grid Array TR Module Based on HTCC Substrate

This paper proposes an X-band four channels Transmitting and Receiving (TR) module based on a High-Temperature Co-fired Ceramic (HTCC) substrate, which is packaged by Ball Grid Array (BGA). Each channel realizes 6-bit phase shifting, 6-bit attenuation, amplification and delay control functions in X band. And Radio Frequency (RF) input ports, RF output ports and low-frequency signal ports are interconnected using BGA technology to realize three-dimensional vertical interconnection. The simulation and test results show that RF delay accuracy is less than $\mathbf{0.02}\ \boldsymbol{\lambda}$. What's more, the input power and the emission efficiency reach 33.5 dBm and 31.9%. In addition, the size of the module is $\mathbf{22}\ \mathbf{mm} \times \mathbf{24}\ \mathbf{mm} \times \mathbf{3.55}\ \mathbf{mm}$.