Hybrid Integration of Polymer PICs and InP Optoelectronics for WDM and SDM Terabit Intra-DC Optical Interconnects

This paper presents a hybrid photonic integration concept based on the use of a polymer motherboard, InP EML arrays and InP PD arrays to realize WDM and SDM Terabit optical engines operating at 100-Gb/s or even at 200-Gb/s per lane. The optical engines are aligned with the Ethernet roadmap, are cost-efficient by design and can find their place in the next generation Terabit IM/DD optical transceivers within Data Centers.