W-Band Waveguide-to-Chip Transition Based on Y-Shaped Quasi-Yagi Antenna Concept

This letter presents an innovative inline waveguide-to-chip transition for MMIC packaging. The design proposes a Y-shaped quasi-Yagi antenna concept, which aims to enhanced coupling efficiency and an extended operating frequency bandwidth. The transition can be integrated into the MMIC to achieve packaging without wire bonding or other electrical interconnection methods. To suppress high-order modes in the oversized transition cavity, periodic pins are strategically introduced as the electromagnetic bandgap (EBG) structure. Finally, the back-to-back transition is fabricated and measured. The measured results show that the prototype covers the entire
$W$
-band with a minimum return loss of 15 dB and an average insertion loss of 0.7 dB.